Bambu Lab’s 3D printing patent application for a new heatbed design may improve peeling issues

Shenzhen Tuozhu Technology, Bambu Lab’s parent company, has filed a patent application in the U.S. for a new heatbed design, which was published on September 10, 2026. This design aims to heat a printbed more evenly, reducing issues with prints as commonly reported by many users of various 3D printer brands. The patent describes the construction, heating method, and its claim of better adhesion to improve print quality.

The abstract of patent US20260264331A1 states: “The heated bed comprises a heated bed body, a heating unit, and a bottom case, wherein one end of the heating unit is configured to be electrically connected to one end of a power supply, and the other end of the heating unit is configured to be electrically connected to the other end of the power supply; the heating unit is disposed between the heated bed body and the bottom case. …