TSMC reportedly weighs 20% CoWoS price increase as Nvidia Blackwell and Rubin chips put pressure on packaging capacity
TSMC is weighing raising prices for its Chip on Wafer on Substrate (CoWoS) advanced packaging technology by as much as 20%, reports Trendforce, citing supply chain sources and local media. The increase reflects strained capacity amid AI demand and longer delivery times for chipmaking tools. Such a hike would be significant, as CoWoS is already one of the tightest links in the AI supply chain. TSMC has yet to confirm the report.
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CoWoS combines logic dies and high-bandwidth memory (HBM) stacks within a single package, which is how AI accelerators get the data bandwidth that demanding workloads require. Building these packages is only getting harder as chip designers cram in more compute and memory. …
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