Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVs

Intel has been granted a U.S. patent that discusses embedding MicroLEDs inside chip packaging, as TrendForce reports. The design embeds semiconductor dies fitted with MicroLEDs directly into a glass substrate and connects them using Through-Glass-Vias (TGV) to provide power and signal connections, allowing them to emit red, green, and blue (RGB) light. Intel suggests this technology could be used for diagnostic testing and to create customized light effects on the chip's surface for personalized electronics and improved aesthetic appeal.

The potential for this to support optical signaling is intriguing, and likely holds significant commercial potential for Intel. Taiwanese optoelectronics firm AU Optronics has a technology roadmap that overlaps with Intel's patent, with some rumored collaboration between the pair, suggesting the two companies may be jointly developing companion technologies in this space.

AUO recently showcased Micro LED optical communication at SEMICON Taiwan 2026, with a design goal interconnect range of up to 10 meters, targeting use in AI data centers. …