Analyzing Intel's EMIB and Foveros advanced packaging roadmaps

Advanced packaging technologies have become integral parts of advanced CPU and GPU designs, and virtually all of Intel's high-end client and data center CPUs rely on its Embedded Multi-die Interconnect Bridge (EMIB) and Foveros technologies. But what's next for these two advanced packaging methods? Before we try to see where both technologies are going, let's first take stock of where we are today.

Although Intel's advanced packaging saga began in 2017 with the Kaby Lake-G CPUs and Stratix 10 FPGAs, packaging technologies weren't quite the hot topic they are today. However, both Intel and its industry peers were working relentlessly to advance these technologies, so Intel was among the first companies to outline a detailed roadmap for multi-chiplet processors featuring its 2.5D and 3D integration technologies — EMIB and Foveros — back in 2020. …